GradConn and GCT Merge

From July 1st, 2024, GradConn & GCT (both Aloco Group companies) will merge under the GCT brand. The planned completion date is Q1 2025.

All current GradConn products will remain available under their existing part codes for the foreseeable future. Please contact us if you need to re-order.

Please use one of the links below to continue your journey.

Even More Choice

Following the merger with GCT your choice of Board-to-Board connectors is now even wider.

GradConn B2B connectors will remain available under the same part code for existing projects. Please contact us if you need to re-order.

Even More Choice

Following the merger with GCT your choice of SIM connectors is now even wider.

GradConn SIM connectors will remain available under the same part code for existing projects. Please contact us if you need to re-order.

From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
New Product - 2007-09-01

.156" & .200" pitch board to board power connectors

.156 & .200" Board to board power connectors

GradConn are pleased to introduce two new ranges of board to board power connectors suitable for
7.9amp current rating.

Connectors are available single in line in 3.96mm 2-24 contacts and 5.08mm 2-20 contacts.

Pin headers are available thru-hole in straight and right angle orientations. Straight female sockets
in both through hole (5.08mm only) and surface mount.

Sockets have a reliable dual contact design, the SMT socket is suitable for dual entry (from either top
or bottom) to allow various mating solutions.

The range is fully ROHS compliant and insulators are LCP (liquid crystal polymer) capable of
withstanding high temperature (280˚C for 10 seconds) during reflow solder process.

Various packaging options are available including tape and reel (for SMT) versions, including an
option of a added plastic cap to aid the vacuum pick and place process.

Click here to see drawings and full product specifications.

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