GradConn and GCT Merge

From July 1st, 2024, GradConn & GCT (both Aloco Group companies) will merge under the GCT brand. The planned completion date is Q1 2025.

All current GradConn products will remain available under their existing part codes for the foreseeable future. Please contact us if you need to re-order.

Please use one of the links below to continue your journey.

Even More Choice

Following the merger with GCT your choice of Board-to-Board connectors is now even wider.

GradConn B2B connectors will remain available under the same part code for existing projects. Please contact us if you need to re-order.

Even More Choice

Following the merger with GCT your choice of SIM connectors is now even wider.

GradConn SIM connectors will remain available under the same part code for existing projects. Please contact us if you need to re-order.

From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
New Product - 2012-04-01

Economical Micro SIM Connector for Micro SIM cards

Wireless connectivity specialist GradConn launches an economical Micro SIM connector for 3FF SIM cards.

The CH03-FB accepts Micro SIM card, also known as Mini UICC or 3FF (3rd form factor), the new form factor is creating a buzz in the market after being included in high profile Apple consumer products.

Micro SIM cards have the same thickness and contact arrangement as Mini SIM card, however the reduced card size of 12mm x 15mm shows significant savings in both PCB and card footprints.

CH03-FB is available at a price point to allow you to transition from traditional Mini SIM design with no price penalty.

A metal cover provides protection against heat warping the Micro SIM card in high temperature applications.

With 6 or 8 contacts and a profile height of just 2.4mm CH03-FB is supplied in tape and reel packaging, withstands IR reflow temperatures and is fully RoHS compliant.

See details including Micro SIM connector 3D IGES model or contact your local GradConn sales office now for pricing and free samples for approval.

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